A team of researchers at Penn State have devised a new, streamlined approach to designing metasurfaces, a class of engineered ...
Modern semiconductor components are becoming more and more complex and cost sensitive. To master technological and economic challenges, new chiplet approaches and heterogeneous integration ...
In pressure relief systems, accurately estimating temperature changes during fluid flow is vital for relief piping ...
As the demand for high-performance processors continues to grow and semiconductor scaling laws continue to show their limits, the need for processor optimization is inevitable. As I explained in a ...
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