At the start of 2026, Taiwan's electronic components and AI server industries continue to post strong export momentum, driven ...

Using TI's 10BASE-T1S Ethernet PHY, automakers can extend Ethernet to vehicle edge nodes with reduced wiring complexity and ...

Geely returned to CES 2026 for the third time, unveiling Full-Domain AI 2.0 and G-ASD to redefine next-gen smart vehicle tech ...

Wolfspeed says its 300mm platform will unify high-volume SiC manufacturing for power electronics with advanced capabilities ...

NVIDIA details next-gen Rubin AI platform at CES 2026: its first extreme-codesigned, six-chip AI platform with next-gen HBM4 ...

Foxconn has hit a new milestone, posting its highest quarterly revenue ever with T$2.6028 trillion (~ US$82.7 billion) in Q4, ...

Provectron, a smart manufacturing partner focused on high-precision automation, today makes its official U.S. debut at CES in Las Vegas. Designed to support manufacturers looking to localize and ...

Hon Hai Precision Industry Co., Ltd. announced unaudited consolidated revenue for December 2025, reaching USD 27.43 billion. This figure represents a 2.20 per cent increase month-on-month and a 31.77 ...

Rubin adds a new central processing unit (CPU) with 88 cores. Cores are the parts of a chip that perform calculations and ...

Real-time hypervisors — the central technology for workload consolidation — enable the safe execution of multiple workloads ...

The company showcases 16-layer HBM4 product with 48GB, next generation HBM product, for the first time during the exhibition. The product is the next generation product of 12-layer HBM4 product with ...

Bosch expects sales of software and services to exceed six billion euros – around two-thirds of this in the Mobility business sector. Intelligent and personalized mobility: Bosch software brings new ...