Wide range of congatec modules support for computationally powerful, energy-efficient embedded AI applications SAN ...

New series of multi-channel power management modules for smartphones and tablets is based on SESUB technology, featuring a power supply management IC chip that is embedded directly into the substrate.

For extra-powerful, high-efficiency inverter systems in railcars, electric power systems and more Mitsubishi Electric’s SBD-embedded SiC-MOSFET modules, including the 3.3kV/800A version released on ...

The CPC2400E is an embedded modern module designed for applications to be used in remote diagnosis, telemetry and monitoring. It offers easy integration and low power consumption in a small footprint ...

TOKYO--(BUSINESS WIRE)-- Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it has developed a new structure for a silicon carbide metal-oxide-semiconductor field-effect transistor ...

The rise of non-PC architectures for mobile phones and tablets extends the benefits of off-the-shelf computing platforms into new markets, where portable and low-energy applications are necessary but ...

KAGA FEI’s WKI611AA1 Wi-Fi 6 and Bluetooth 5.4 combo module simplifies the development of low-power embedded devices. With a built-in antenna and multiple certifications, it reduces antenna ...

The new high-performance modules deliver up to 180 TOPS of power-efficient computation designed for next-level AI ...

TOKYO--(BUSINESS WIRE)--Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it has begun shipping low-current 3.3kV/400A and 3.3kV/200A versions of a Schottky barrier diode (SBD) ...