Stacking chiplets vertically using short and direct wafer-to-wafer bonds can reduce signal delay to negligible levels, enabling smaller, thinner packages with faster memory/processor speeds and lower ...
The shift from planar SoCs to 3D-ICs and advanced packages requires much thinner wafers in order to improve performance and reduce power, reducing the distance that signals need to travel and the ...
NexWafe’s high-throughput epitaxy tool, ProCon 2.5. Image: NexWafe German solar wafer manufacturer NexWafe has announced “key milestones” in its epitaxial wafer production which it claims can reshape ...
Flip-and-Lap in the fab moves image array to front of imager, which yields sharper, more sensitive pixels, but wafer bonding step adds cost. Tessera Technologies reports a conflict (and resolution) ...
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