Engineers are starting to build hardware that does not just run artificial intelligence, it behaves like a primitive form of ...

A new technical paper titled “An Energy Efficient Memory Cell for Quantum and Neuromorphic Computing at Low Temperatures” was published by researchers at Forschungszentrum Jülich, RWTH Aachen ...

Advancing AI Chip Manufacturing With Applied Materials Today Building the chips that power artificial intelligence is getting ...

Developed core technology that will allow practical implementation of high-density, low-power 3D DRAM, presented at IEEE International Electron Devices Meeting (IEDM) ...

Dynamic random access memory (DRAM) remains a cornerstone of modern electronic systems, enabling rapid data storage and retrieval. Recent developments have focused on capacitorless designs – notably ...

Bioengineers at Stanford University have created the first biological transistor made from genetic materials: DNA and RNA. Dubbed the "transcriptor," this biological transistor is the final component ...

AI is driving demand and higher prices for DRAM and NAND into 2026.  Products using non-volatile memories to replace NOR and ...

Released every 12 to 18 months, 3D NAND scaling outpaces most other semiconductor devices in replacement rate and performance ...

This year’s top semiconductor stories were mostly about the long and twisting trips a technology takes from idea (or even raw ...

Vertical scaling is vital to increasing the storage density of 3D NAND. According to imec, airgap integration and charge trap layer separation are the keys to unlocking it. Inside the charge trap cell ...