Figure 1. A model INL 8 layer metal network assembled from M1, M2, and M4 layers from a 32nm CMOS logic circuit. The INL is fabricated on a Si substrate by 32nm capable BEOL tool sets. The total ...
To summarize, SiGen has extended its NANOCLEAVE applications to 3DIC and has been issued a growing number of US and worldwide patents for (1) alternative cleave plane formation and cleave initiation ...
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