System-in-package (SiP) and other advanced packaging technologies are putting more components together in tighter spaces than previously seen. Often these packages are contained in a module, which is ...
Even a small array consisting of 100 elements has thousands of individual components that require perhaps 25,000 measurements per module for an eye-watering grand ...
December 2, 2013. GOEPEL electronic has extended its SCANFLEX boundary scan hardware product range by introducing the SFX Gang Test Module Kit for parallel test and programming of up to 32 different ...
In the world of embedded systems, it isn’t just the technology that continues to develop and evolve. The tools and the methods used to develop that technology are maturing and improving in tandem. In ...
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