Apple is expected to use TSMC's new 2nm process and SoIC-X (System on Integrated Chip) advanced packaging technology in the second half of 2025, according to new reports. AMD was the first to adopt ...

In a new report from Ctee, Apple has the first production capacity out of TSMC in 2025 for its new 2nm process node, with plans to use next-generation 3D advanced packaging platform SoIC (or System on ...

Frenchtown, N.J. — Aries Electronics has introduced a RoHS-compliant version of its DIP to SOIC Correct-A-Chip adapter that offers an easy method of converting DIP style packaging to SOIC ...

The AI surge requires TSMC to swiftly expand its production capacity for chip-on-wafer-on-substrate (CoWoS) packaging. Simultaneously, the foundry's production capacity for 3D-stacked ...

TSMC has reportedly secured four major clients for its latest SoIC packaging – AMD, Nvidia, Broadcom, and Apple. The chip manufacturer is actively working on increasing its next-generation chip ...

TSMC is expected to continue its advanced packaging development focus on 3D SoIC (system on integrated chips) technology and organic interposer in 2021, although it has fabricated WSE (wafer-scale ...

Amid scrutiny over Washington’s 10% stake in Intel, TSMC is pressing ahead with its U.S. expansion. MoneyDJ reports that site prep is underway for its two advanced packaging plants (AP1, AP2) in ...

IXYS Corporation announced its new 60 V, dual and normally open solid-state relay with the highest current rating in a SOIC package. It provides 400 V of input-to-output isolation; and comprises two ...

TSMC plans to create synergies with a range of companies via the establishment of a Japanese research institute for development of materials for 3D SoIC packaging in Japan. TSMC is emphasizing that 3D ...

High-reliability packages, always in demand within the automotive, medical, and RF fields, are now going green. A fully qualified flip-chip small-outline IC (FC-SOIC) narrow body package developed by ...

Next-generation automotive and power applications will benefit from a fully qualified family of high-reliability small-outline IC (SOIC) packages. The narrow-body packages provide zero delamination ...