NXP Semiconductors has claimed the industry’s first top-side cooling solution for RF power, which reduces the thickness and weight of 5G radios by more than 20 percent. The new family of top-side ...

As part of the BEYOND5 project, CEA-Leti was responsible for developing a RF power module (FEM) combining three essential RF functions: a power amplifier (PA), which amplifies transmitted signals; a ...

Packaging innovation has always been critical to the cooling of components, especially for power-switching devices such as MOSFETs and IGBTs. The non-stop demand to make these devices smaller and ...

EINDHOVEN, The Netherlands, June 06, 2023 (GLOBE NEWSWIRE) -- NXP Semiconductors (NASDAQ: NXPI) announced today a family of top-side cooled RF amplifier modules, based on a packaging innovation ...

NXP Semiconductors is making available its 2nd generation of comprehensive Airfast RF power Multi-Chip Modules (MCMs) designed to support the evolution of 5G mMIMO active antenna system requirements ...

GREENSBORO, N.C.--(BUSINESS WIRE)--Guerrilla RF, Inc. (OTCQX: GUER) today announced that its high-efficiency GRF5509 4-watt power amplifier was selected by Impinj (NASDAQ: PI) for use in their ...

NXP’s RF Airfast multi-chip modules offer a common footprint across frequency and power for different regions NXP’s RF Airfast multi-chip modules offer a common footprint across frequency and power ...

TOKYO--(BUSINESS WIRE)--Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it will launch a 50W silicon radio-frequency (RF) high-power metal-oxide semiconductor field-effect ...

Empower RF Systems has announced the release of its latest C-UAS RF amplifier module, Model 1211, engineered for robust ...