The state-of-the-art topside cooling (GTPAK™) and gull-wing (GLPAK™) packages meet increased performance and robust environmental demands State-of-the-art topside cooling (GTPAK™) and gull-wing ...
Vishay Intertechnology, Inc. (NYSE: VSH) today introduced five new 1200 V MOSFET power modules designed to increase power ...
The best-performing and most cost-effective power MOSFETs might well turn out to be those having no package at all. With power-MOSFET silicon now largely optimized, manufacturers are quickly ...
The AOLV66935 designed by Alpha and Omega Semiconductor is a 100V N-channel High Safe Operating Area (SOA) MOSFET ...
Diodes Incorporated, a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic and analog semiconductor markets, announced the ...
Toshiba has created a gull-wing mosfet package specifically for high current automotive applications, and has released a 400A 40V mosfet in it. Branded L-TOGL and measuring 9.9 x 11.8 x 2.3mm (right), ...
For many recent generation power semiconductors, package innovation makes a significant contribution to key performance parameters. In the case of HV MOSFETs, high-speed hard-switching transitions are ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Fairchild Semiconductor (NYSE: FCS) brings designers of servers, blade servers and routers the industry’s first sub-one mOhm 30V MOSFET in a Power 56 package. This ...
Toshiba America Electronic Components Inc. (TAEC) has announced TSSOP Advance, a new smaller packaging technology that extends the company's diverse packaging options for power MOSFETs. Developed by ...
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