The kind of lapping plate Insaco uses plays a vital role in the lapping process. It significantly affects the output of this abrasive machining technique. A plate should not be too hard as it damages ...

The lapping process involves thinning wafers from the back with a rotating abrasive surface. It is important to receive precise feedback as the process is carried out to monitor the quantity of ...

Lapping is a final abrasive finishing operation that produces extreme dimensional accuracy, corrects minor imperfections of shape, refines surface finish and produces close fit between mating surfaces ...

Sponsored by Vitrek, LLCReviewed by Maria OsipovaOct 9 2025 The wafer lapping process is key to effective semiconductor thinning. It requires extremely tight control to avoid over-removal of material ...