Packing more IC functionality into smaller form factors stacks the deck against IC makers and foreshadows difficult interconnect challenges. How much can one package take? As consumer electronics ...

CHANDLER, Ariz.– Amkor Technology Inc. here today announced it will offer faster turnaround times for assembled chips in quad flat no-lead (QFN) packages as a result of a new saw-singulated process, ...

Editor’s note: It’s not enough to choose an IC for your design just by what is in the data sheet; you will need to choose the right package and pay attention to the manufacturing and assembly needs of ...