The complexity of DRC rules increases with shrinking geometries. It is not that the laws of physics change with shrinking IC feature size; they are just more strictly enforced. At one time, there was ...

The pace of innovation in advanced packaging is rewriting the rules that IC and package teams have relied on for decades.

As integrated circuit (IC) designs have grown in complexity, scale and speed requirements, design rule checking (DRC) has evolved from a routine step into a critical pillar of successful tapeouts.

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

IC designers are a lucky bunch. Through many years of semiconductor process evolution, the impact of manufacturing limitations and variations on layout could be encapsulated in relatively simple ...