Micron (MU) broke ground on a new high-bandwidth memory advanced packaging facility adjacent to the company’s current facilities in Singapore. The new HBM advanced packaging facility will be the first ...
The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory ...
Micron Technology, Inc. has commenced the construction of a High-Bandwidth Memory (HBM) advanced packaging facility in Singapore, the first of its kind in the country. The groundbreaking ceremony ...
SK Hynix recently announced a major investment in a new South Korean plant. The Icheon-based company will spend $12.9 billion to develop a facility dedicated to advanced ...
SK Hynix, Samsung, TSMC, and Micron are investing billions to meet demand for high-bandwidth memory and advanced chips for the AI boom.
TL;DR: SK hynix is developing High Bandwidth Storage (HBS), combining mobile DRAM and NAND in a single package using innovative Vertical Wire Fan-Out (VFO) technology. This multi-layer stacked memory ...
Weaver—the First Product in Credo’s OmniConnect Family—Overcomes Memory Bottlenecks in AI Inference Workloads to Boost Memory Density and Throughput Credo Technology Group Holding Ltd (Credo) (NASDAQ: ...
Results that may be inaccessible to you are currently showing.
Hide inaccessible results