The move to heterogeneous multi-chip/chiplet products improves yield, performance and modularity while reducing power and overall product footprint. However, this shift to heterogeneous assembly also ...
SEMICON Taiwan 2024 is set to take place from September 4-6 at the Taipei Nangang Exhibition Center, spotlighting key industry themes such as the AI value chain, advanced processes, heterogeneous ...
A new technical paper titled “Harnessing Heterogeneity for Targeted Attacks on 3-D ICs” was published by Drexel University. “As 3-D integrated circuits (ICs) increasingly pervade the microelectronics ...
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