Why non-destructive SAM is an efficient tool for analysis of adhesion between layers and presence of possible flaws in each layer. Scanning acoustic microscopy, or SAM, is a non-destructive technique ...
Most automated quality inspection technologies involve machine vision systems and, increasingly, aspects of artificial intelligence-powered software to speed the identification of part defects. But ...
A new technical paper titled “Recent Progress in Structural Integrity Evaluation of Microelectronic Packaging Using Scanning Acoustic Microscopy (SAM): A Review” was published by researchers at ...
For the best results with SAM systems, pay close attention to both the digitizer characteristics and the signal path. Automated inspection techniques are widely used in the semiconductor industry for ...
View of cantilever on an atomic force microscope (magnification 1000x). Credit: SecretDisc GFDL, CC-BY-SA-3.0 Long before the development of AFM, Quate’s research had made waves in microscopy. 1978 ...
Hybrid bonding—a significant advancement in chip packaging technology—is becoming vital in heterogeneous integration, which enables semiconductor companies to merge multiple chiplets with diverse ...
Traditional ultrasonic imaging systems usually transmit broadband ultrasonic pulses through the full sample volume under study. By analyzing these pulses, researchers can measure sample thickness, ...
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