It has taken decades of research and development and strong commitment to various industry programs, but the stars are finally aligning for 3D semiconductor systems. No one could have left the 3D & ...

This review article, authored by Dr. Weidong Zhang’s team from Shanghai Jiao Tong University, was recently published in the journal Robot Learning. Focusing on the increasingly prominent topic of ...

Modern semiconductor components are becoming more and more complex and cost sensitive. To master technological and economic challenges, new chiplet approaches and heterogeneous integration ...

At The Next FPGA Platform event in San Jose, California on January 22, Jose Alvarez, Intel PSG CTO, Jose Alvarez outlined the three levels of heterogeneous integration. It’s a simple taxonomy. First, ...