Samsung Electronics is reportedly finalizing investment plans for the first production line at its Pyeongtaek Plant 4 (P4) facility in South Korea, rebranding it to focus on mass-producing advanced ...
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SK Hynix's $13B packaging facility promises more HBM for the AI bubble
Great news for AMD and Nvidia, less so for cash-strapped consumers Memory makers just can't churn out their DRAM fast enough.
Applied Materials, Inc. is a key enabler of AI-driven chip innovation, with strong positions in advanced DRAM, packaging, and critical process technologies. Despite short-term China-related headwinds, ...
The sluggish recovery in memory end-market demand has led to an early slowdown in supply chain activity, impacting the operational growth of memory packaging and testing firms in the second half of ...
TL;DR: SK hynix has completed the re-purposing of its M10F semiconductor fab in Icheon, South Korea, converting DRAM packaging lines to HBM packaging lines. This expansion increases HBM production ...
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