Molex's VITA 66.1 ruggedized optical MT backplane interconnect solution is designed for high-density aerospace, defense and commercial embedded system applications. Fully compliant with the ...

High-speed interconnects may be used to link chips, boards or systems. The distance between target devices is the major difference. Chip-to-chip interconnects normally span less than 20 inches, are ...

When work started on developing the VPX backplane standard in 2004, members of the VITA Consortium wanted to create something which represented the next revolution in bus boards. The work drew on ...

LAUSANNE, SWITZERLAND--(Marketwired - January 13, 2016) - Kandou Bus will present a paper at DesignCon 2016 that will compare the sensitivity of PAM4 and Ensemble NRZ ("ENRZ") to inter-symbol ...

Teradyne, the supplier of backplane interconnection systems, has teamed up with Rambus to demonstrate a 10Gbit/s interface over a single differential pair for use in high-performance backplanes. The ...

The GbX connector system enables signal speeds from 6 Gb/s to 10 Gb/s while providing high packing density with up to 69 differential pairs per linear inch (27 differential pairs per 10 mm). It is ...

Smiths Interconnect has launched its LightCONEX optical plug-in and backplane module connectors compatible with the VITA 66.5 draft standard and aligned with the SOSATM Technical Standard for VPX ...

Backplane interconnect systems provider Amphenol and high-speed interconnect supplier FCI entered into second source agreements covering three connector product families: Amphenol's XCede and Crossbow ...

HUBER+SUHNER has developed a VITA 67 multi-coaxial RF backplane connection system intended for side-by-side implementation with VITA 46 and VITA 66 hardware. The devices are specifically for ...

MILPITAS, CA--(Marketwired - January 30, 2017) - Credo Semiconductor, a global innovation leader in Serializer-Deserializer (SerDes) technology, today announced it will conduct multiple demonstrations ...