ERS's new Luminex machines offer a unique solution for stress-free debonding, saving more than 30% in operation costs compared to traditional laser debonding. They are engineered with robust wafer ...
AUSTIN, TX, UNITED STATES, May 23, 2023/EINPresswire.com/ -- PulseForge, Inc. and ERS electronic GmbH have announced a strategic alliance to bring a fully-automated ...
Suitable for wafer-level and panel-level packaging, Photonic Debonding delivers a clean wafer separation solution at a significantly lower cost than lasers. Our photonic debonding solutions provide ...
We are so excited to partner with PulseForge and bring this new technology to market. There is significant interest in this new debonding platform from customers and we will begin shipments in 2024.” ...
Strategic partnership kicks off with installation of EVG850 automated laser debonding system at the newly launched Center for Advanced CMOS and Heterointegration Saxony (CEASAX) Kicking off this ...
IBM's Hybrid Laser Release Process technology complements EV Group's low-temperature laser debonding equipment and process portfolio designed to enable highly flexible, high-throughput solution. ST.
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